Centip3De: A 3930DMIPS/W Configurable Near-Threshold 3D Stacked System with 64 ARM Cortex-M3 Cores

📋 论文概要

本文提出了一种名为Centip3De的3D堆叠系统，通过近阈值计算（NTC）技术大幅降低功耗，实现了3930 DMIPS/W的高能效，集成了64个ARM Cortex-M3核心，解决了3D集成中功率密度过高的问题。

💡 主要创新点

• 采用近阈值计算（NTC）技术，在接近阈值电压下运行核心，显著降低功耗。
• 利用3D堆叠技术集成64个ARM Cortex-M3核心，实现高计算密度和能效。
• 通过配置和电压调节，在性能和功耗之间实现灵活权衡。

🏷 关键词

📄 原文摘要

Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory Chen, Trevor Mudge, Dennis Sylvester, David Blaauw University of Michigan, Ann Arbor, MI Recent high performance IC design has been dominated by power density constraints. 3D integration increases device density even further, and these devices will not be usable without viable strategies to reduce power consumption. This paper proposes the use of near-threshold computing (NTC) to address this issue in a stacked 3D system. In NTC, cores are operated near the threshold voltage (~200mV above Vth) to optimally balance power and performance [1]. In Centip3De, we operate cores at 650mV, as opposed to the wear-out limited supply voltage of 1.5V. This improves measured energy efficiency by 5.1×. The dramatically lower power consumption of NTC makes it an attractive match for 3D design, which has limited power dissipation capabilities, but also has improved

👥 作者与机构

David Fick, Ronald G. Dreslinski, Bharan Giridhar, Gyouho Kim,