Towards Ultra-Dense Arrays of VHF NEMS with FDSOI-CMOS Active Pixels for Sensing Applications

📋 论文概要

该论文提出了一种基于FDSOI-CMOS有源像素的超密集甚高频NEMS阵列，用于传感应用。通过将NEMS与CMOS集成，解决了高密度阵列中信号读取和噪声抑制的难题，实现了快速响应和高灵敏度检测。

💡 主要创新点

• 首次将FDSOI-CMOS有源像素与NEMS谐振器集成，形成超密集阵列，提升了传感密度和信号处理能力。
• 利用CMOS工艺兼容的NEMS制造技术，实现了亚微米尺寸的谐振器，降低了功耗并提高了检测灵敏度。

🏷 关键词

📄 原文摘要

progressing from MicroElectroMechanical Systems to NanoElectroMechanical Systems (NEMS). Indeed, NEMS are emerging as a new field of interest because their submicron dimensions make them converge towards CMOS fabrication processes. They have specific advantages such as fast response time and high detection sensitivity when used as a resonant sensor [1]. From the application point of view, NEMS interact “naturally” with the nanoscale world and can sense unprecedented physical and biological phenomena, such as the mass of a single molecule, the force exerted by living cells or certain biochemical reactions. In the next five to ten years, NEMS should offer a real breakthrough for mass spectrometry or gas analysis applications because they can achieve similar resolution to conventional lab equipment but at a lower co

👥 作者与机构

Gregory Arndt, Cecilia Dupré, Julien Arcamone, Gérald Cibrario,

Olivier Rozeau, Laurent Duraffourg, Eric Ollier, Eric Colinet CEA-LETI-MINATEC, Grenoble, France Similar to transistors, the size of MEMS components is continuously shrinking,