⚡ 本页包含 AI 生成的分析内容,仅供参考
该论文提出了一款采用30nm工艺、1.2V供电的4Gb DDR4 SDRAM,实现了3.2Gb/s/pin的数据速率。通过双错误检测和PVT容忍的数据获取方案,解决了高速数据传输中的可靠性和时序问题。
Sanghee Kang, Dongsu Lee, Hangyun Jung, Hanki Jeoung, Ki-Won Lee, Junsuk Park, Jongeun Lee, Byunghyun Lee, Inwoo Jun, Juseop Park, Junghwan Park, Hundai Choi, Sanghee Kim, Haeyoung Chung, Young Choi, Dae-Hee Jung, Jang Seok Choi, Byungsick Moon, Jung-Hwan Choi, Byungchul Kim, Seong-Jin Jang, Joo Sun Choi, Kyung Seok Oh Samsung Electronics, Hwasung, Korea A higher performance DRAM is required by the market due to the increasing of bandwidth of networks and the rise of high-capacity multimedia content. DDR4 SDRAM is the next-generation memory that meets these demands in computing and server systems. In comparison with current DDR3 memory, the major changes are supply voltage reduction to 1.2V, pseudo open drain I/O interface, and data rate increase from 1.6 to 3.2Gb/s. To achieve high performance at low supply voltage and reduce power consumption, this work introduces new functions and describes their implementation. Data bus inversion (DBI) is employed
Kyomin Sohn, Taesik Na, Indal Song, Yong Shim, Wonil Bae,