⚡ 本页包含 AI 生成的分析内容，仅供参考
本文提出一种在0.11µm标准CMOS工艺中实现的1920×1080分辨率、3.65µm像素尺寸的2D/3D图像传感器，采用分裂和合并像素结构，解决了单芯片实现2D彩色成像与ToF深度成像的挑战。
very crucial in various applications such as robotics, automotive, augmented reality, and interactive gaming, because it enables electronic devices to recognize and track target objects without complicated post-processing. Numerous color image sensors have been developed, pushing small-size and high-sensitivity pixels [1,2]; likewise, time-of-flight (ToF) depth imagers, where pixels directly provide their own depth information, have been presented based on singlephoton avalanche diodes (SPADs) [3] and photo-mixing devices [4]. However, it is still challenging to implement a single image sensor that can simultaneously acquire color and depth images. This is because the principles of operation for acquisition of both types of images are totally different, resulting in a difference
Seong-Jin Kim, Byongmin Kang, James D. K. Kim, Keechang Lee,
Chang-Yeong Kim, Kinam Kim Samsung Advanced Institute of Technology, Yongin, Korea Real-time capturing of a color image and depth map from an arbitrary scene is