A Modular 1mm3 Die-Stacked Sensing Platform with Optical Communication and Multi-Modal Energy Harvesting

📋 论文概要

本文提出一种体积仅为1mm³的模块化堆叠传感平台，通过光学通信实现无线数据传输和编程，并集成多模态能量收集技术，解决了现有微传感器节点体积大、寿命短且无法远程编程的问题。

💡 主要创新点

• 采用芯片堆叠技术实现1mm³超小体积的模块化传感平台，突破传统传感器节点尺寸限制。
• 利用光学通信替代射频通信，在微尺度下实现低功耗无线数据传输和远程重编程能力。
• 集成多模态能量收集（如光、振动等），使节点能够从环境中持续获取能量，实现自供电运行。

🏷 关键词

📄 原文摘要

applications such as smart buildings, medical implants, and surveillance systems. However, existing devices are bulky, measuring >1cm3, and they are hampered by short lifetimes and fail to realize the “smart dust” vision of [1]. Smart dust requires a mm3-scale, wireless sensor node with perpetual energy harvesting. Recently two application-specific implantable microsystems [2][3] demonstrated the potential of a mm3-scale system in medical applications. However, [3] is not programmable and [2] lacks a method for re-programming or re-synchronizing once encapsulated. Other practical issues remain unaddressed, such as a means to protect the battery during the time period between system assembly and deployment and the need for flexible design to enable use in multiple application domains. To this end, we

👥 作者与机构

Yoonmyung Lee, Gyouho Kim, Suyoung Bang, Yejoong Kim, Inhee Lee,

Prabal Dutta, Dennis Sylvester, David Blaauw University of Michigan, Ann Arbor, MI Wireless sensor nodes have many compelling