All-Digital Hybrid Temperature Sensor Network for Dense Thermal Monitoring

📋 论文概要

该论文提出了一种全数字混合温度传感器网络，用于密集热监测，以解决高性能处理器中片上温度传感器数量增加带来的面积和放置规则性挑战。

💡 主要创新点

• 提出全数字混合温度传感器架构，实现面积高效和规则化的传感器阵列。
• 设计了可扩展的传感器网络，支持密集热监测和空间温度分布获取。
• 通过混合数字输出方式简化了温度读取接口，降低了系统复杂度。

🏷 关键词

📄 原文摘要

spatial temperature distribution, which is essential for dynamic thermal management [1,2]. The number of on-chip temperature sensors in highperformance processors is increasing, with state-of-the-art commercial processors embedding up to 44 on-chip sensors [3] and the number is likely to increase in the future (Fig. 14.7.1(a)). We observe two significant challenges in on-chip temperature sensing: 1) the increasing number of sensors, and 2) placing them in a regular manner (not solely on the potential hotspots). The number of sensors is mostly constrained by their area. Indeed, the sensor area is difficult to shrink since large delay lines or a BJT with a large ADC, and digital circuits are required to generate a proportional-to-absolute-temperature (PTAT)

👥 作者与机构

Seungwook Paek, Wongyu Shin, Jaeyoung Lee, Hyo-Eun Kim,

Jun-Seok Park, Lee-Sup Kim KAIST, Daejeon, Korea Technology scaling and many-core design trends demand detailed information regarding the