A 5.5Gb/s 5mm Contactless Interface Containing a 50Mb/s Bidirectional Sub-Channel Employing Common-Mode OOK Signaling

📋 论文概要

本文提出一种基于封装内耦合器的5.5Gb/s、5mm距离无接触接口，并集成50Mb/s双向子通道，采用共模OOK信令。该接口旨在替代传统线束和连接器，提供抗机械故障、防水/化学品隔离及低成本等优势，同时避免传统无线电技术在短距离通信中的功率效率问题。

💡 主要创新点

• 提出一种共模OOK信令方案，在无接触耦合器上同时实现高速主通道和低速双向子通道，无需额外功耗或面积。
• 采用封装内耦合器设计，实现5mm距离的5.5Gb/s数据传输，同时支持50Mb/s双向通信，兼顾高速与低功耗。
• 通过共模信号传输子通道，避免对差分主通道的干扰，实现全双工双向通信。

🏷 关键词

📄 原文摘要

replace existing interfaces that use wire harnesses and connectors, are expected to be employed in many applications because they would provide such features as immunity to mechanical failures due to vibration/friction, isolation from water/chemicals, and lower fabrication costs. Such conventional radio-wave techniques as UWBs or mm-waves that have been optimized for communication at distances greater than 1cm would suffer from inefficiency in power performance compared with wireline communications. This paper introduces proximity communication using a coupler-in-package that provides a wide-band channel between modules. The relatively large coupler-size in our coupler-in-package permits communication distances to be 1cm or less, while conventional techniques for communication between stacked chips [1,2] have communication

👥 作者与机构

Ken’ichiro Hijioka, Masaharu Matsudaira, Koichi Yamaguchi, Masayuki Mizuno

Renesas Electronics, Kawasaki, Japan High-volume, mm-range, contact-less interfaces between modules, which would