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ISSCC 2013Session 3 · PROCESSORSDigital Processors

Bandwidth and Power Management of Glueless 8-Socket SPARC T5 System

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📋 论文概要

该论文介绍了基于SPARC T5处理器的Oracle T系列系统,通过1跳无粘合连接实现从1到8个插槽的扩展,并优化了带宽和电源管理。系统集成了16个8线程核心、8MB L3缓存、4个片上内存控制器和2个PCIe Gen 3接口,解决了多核多线程设计中硬件与软件集成带来的带宽和功耗挑战。

💡 主要创新点

重要性
发表年份
ISSCC 2013

🏷 关键词

SPARC T5多核处理器带宽管理电源管理无粘合连接

📄 原文摘要

Oracle, Santa Clara, CA, 2 Oracle, San Diego, CA 1 Continuous advancement in multicore and multi-threaded design requires optimized integration of hardware and software to address increasing bandwidth and power management challenges for high-end system designs. The next generation Oracle T-series systems utilizing the SPARC T5 processor address these challenges. These systems scale from one to eight sockets using a 1-hop glueless connection. The processor implements 16 8-threaded cores, an 8MB L3 cache, four on-chip memory controllers and two on-chip PCIE Gen 3 interfaces

👥 作者与机构

Venkatram Krishnaswamy1, Dawei Huang2, Sebastian Turullols1, Jinuk Luke Shin1

分类:Digital Processors · 年份:ISSCC 2013