⚡ 本页包含 AI 生成的分析内容，仅供参考
该论文提出了一种基于硅通孔（TSV）的双面集成微系统，用于神经传感应用。通过将传感电极和信号处理电路集成在芯片两侧，解决了传统神经记录系统体积大、信号噪声高的问题，实现了小型化、高信噪比的神经信号采集。
Shih-Wei Lee1, Ching-Te Chuang1, Kuan-Neng Chen1, Jin-Chern Chiou1,2, Wei Hwang1,3, Yen-Chi Lee3, Chung-Hsi Wu3, Kuo-Hua Chen3, Chi-Tsung Chiu3, Ho-Ming Tong3 National Chiao Tung University, Hsinchu, Taiwan, 2 China Medical University, Taichung, Taiwan, 3 Advanced Semiconductor Engineering Group, Kaohsiung, Taiwan 1 Highly integrated and miniaturized neural sensing microsystems that provide stable observation, small form factor and biocompatible properties are crucial for brain function investigation and neural prostheses realization for capturing accurate signals from an untethered subject in his natural habitat [1, 2]. Such biomedical devices usually comprise sensors and CMOS circuits for biopotential acquisition, signal conditioning, processing and transmission. Many approaches have been reported, including stacked multichip [3, 4], microsystem with separated neural sensors [5] and monolithic packaged microsystem [6]. Regardless
Chih-Wei Chang1, Po-Tsang Huang1, Lei-Chun Chou1, Shang-Lin Wu1,