⚡ 本页包含 AI 生成的分析内容，仅供参考
该论文实现了一款采用28nm高k金属栅工艺的单芯片通信处理器，集成了1.5GHz双核应用处理器和LTE/HSPA+基带，旨在满足智能手机对高数据吞吐量的需求。通过工艺优化和架构设计，实现了高性能与低功耗的平衡。
Kohei Wakahara1, Tsugio Matsuyama1, Keiji Hasegawa1, Toshiharu Saito1, Akira Fukuda1, Kaname Teranishi1, Kazuki Fukuoka2, Noriaki Maeda2, Koji Nii2, Takeshi Kataoka1, Toshihiro Hattori1 Renesas Mobile, Tokyo, Japan, Renesas Electronics, Tokyo, Japan 1 2 The increase in the use and number of smartphone devices is causing heavy data traffic volumes on existing 3G mobile wireless networks. LTE, often referred to as 4G, offers true mobile broadband. It is a new network and access technology that provides new spectrum resources, much increased spectral efficiency, higher throughputs (150Mb/s with higher rates to come), at lower latency and it uses an IP-based infrastructure. LTE is the solution to mitigate the traffic load issue and it is being rolled out around the world. The proposed communication processor R-Mobile U2 (RMU2) achieves single-chip integration of a 1.5GHz dual-core application processor and a triple mode (GSM/WCDMA/LTE) baseband processor. Key design highlights of the RMU2
Masaki Fujigaya1, Noriaki Sakamoto1, Takao Koike1, Takahiro Irita1,