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ISSCC 2014Session 10 · MOBILE SYSTEMS-ON-CHIP (SoCs)AI / ML

A 1.22TOPS and 1.52mW/MHz Augmented Reality Multi-Core Processor with Neural Network NoC for HMD Applications

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📋 论文概要

该论文提出了一款面向头戴式显示器(HMD)应用的增强现实多核处理器,通过神经网络片上网络(NoC)实现高效的数据通信,在1.22TOPS算力和1.52mW/MHz能效下支持无标记的3D物体实时渲染,解决了传统AR系统计算能力不足的问题。

💡 主要创新点

核心指标
1.22TOPS, 1.52mW/MHz
重要性
发表年份
ISSCC 2014

🏷 关键词

增强现实多核处理器神经网络NoC

📄 原文摘要

augmentation of images in a real-world environment. Wearable systems, such as head-mounted display (HMD) systems, have attempted to support real-time AR as a next generation UI/UX [1-2], but have failed, due to their limited computing power. In a prior work, a chip with limited AR functionality was reported that could perform AR with the help of markers placed in the environment (usually 1D or 2D bar codes) [3]. However, for a seamless visual experience, 3D objects should be rendered directly on the natural video image without any markers. Unlike marker-based AR, markerless AR requires natural feature extraction, general object recognition, 3D reconstruction, and camera-pose estimation to be performed in parallel. For instance, markerless AR for a VGA input-test video

👥 作者与机构

Gyeonghoon Kim, Youchang Kim, Kyuho Lee, Seongwook Park,

Injoon Hong, Kyeongryeol Bong, Dongjoo Shin, Sungpill Choi, Jinwook Oh, Hoi-Jun Yoo KAIST, Daejeon, Korea Augmented reality (AR) is being investigated in advanced displays for the

分类:AI / ML · 年份:ISSCC 2014