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ISSCC 2014Session 10 · MOBILE SYSTEMS-ON-CHIP (SoCs)Digital Processors40nm LP-CMOS

A 0.74V 200µW Multi-Standard Transceiver Digital Baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 Personal Area Networks

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📋 论文概要

本文提出了一款工作在0.74V电压、功耗仅200µW的多标准收发器数字基带芯片,采用40nm LP-CMOS工艺,支持2.4GHz频段的Bluetooth Smart、ZigBee和IEEE 802.15.4标准,解决了超低功耗短距无线连接中多标准兼容与能量效率的矛盾。

💡 主要创新点

核心指标
0.74V供电, 200µW功耗
工艺节点
40nm LP-CMOS
重要性
发表年份
ISSCC 2014

🏷 关键词

多标准收发器数字基带超低功耗

📄 原文摘要

Mario Konijnenburg, Yan Zhang, Jan Stuyt, Maryam Ashouei, Guido Dolmans, Tobias Gemmeke, Harmke de Groot Holst Centre/imec, Eindhoven, The Netherlands Ultra-low-power (ULP), short-range wireless connectivity is becoming increasingly relevant to a wide range of sensor and actuator node applications, ranging from consumer lifestyle to medical applications. In recent years, a multitude of wireless standards has been proposed to meet differing requirements of individual application domains such as data rates, range, QoS, peak and average power consumption. From a commercial perspective, a single radio component that is capable of supporting multiple wireless standards – targeting multiple application domains/markets – while reducing integration costs is highly preferable. At the same time, the multi-standard support may not compromise low-power operation or silicon area. In this paper, we present a multi-standard digital baseband (DBB) ASIC for a

👥 作者与机构

Christian Bachmann, Gert-Jan van Schaik, Benjamin Busze,

分类:Digital Processors · 年份:ISSCC 2014