← 返回论文列表 📄 下载原文 PDF  ISSCC 2014 · 19.1
ISSCC 2014Session 19 · NONVOLATILE MEMORY SOLUTIONSMemory16nm planar cell

A 128Gb MLC NAND-Flash Device Using 16nm Planar Cell

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

该论文介绍了一款采用16nm平面单元技术的128Gb MLC NAND闪存器件,实现了高存储密度和成本效益,解决了NAND闪存按比例缩小的挑战。

💡 主要创新点

核心指标
128Gb容量, MLC, 16nm平面单元
工艺节点
16nm planar cell
重要性
发表年份
ISSCC 2014

🏷 关键词

NAND闪存16nm平面单元MLC高密度

📄 原文摘要

Cairong Hu1, Heonwook Kim1, Kalyan Kavalipurapu1, Eric Lee1, Ali Mohammadzadeh1, Dan Nguyen1, Vipul Patel1, Ted Pekny1, Bill Saiki1, Daesik Song1, Jeff Tsai1, Vimon Viajedor1, Luyen Vu1, Tinwai Wong1, Jung Hee Yun1, Ramin Ghodsi1, Andrea D’Alessandro2, Domenico Di Cicco2, Violante Moschiano2 Micron, San Jose, CA, 2Micron, Avezzano, Italy 1 The aggressive scaling of NAND Flash memory technology—one that is even outpacing Moore’s Law—has enabled very rapid cost-per-bit reduction, resulting in an explosion of systems utilizing this versatile memory technology. From removable media and personal music players to smart phones, tablets, and now personal computers and data center applications employing client and enterprise solid state drives (SSDs), NAND technology is making solid-state memory-based storage affordable. Maintaining this rapid pace in cost reduction faces many challenges, especially

👥 作者与机构

Mark Helm1, Jae-Kwan Park1, Ali Ghalam1, Jason Guo1, Chang wan Ha1,

分类:Memory · 年份:ISSCC 2014