⚡ 本页包含 AI 生成的分析内容,仅供参考
该论文提出了一种在28nm CMOS工艺中实现的嵌入式1Mb ReRAM,通过采用摆动采样耦合读出放大器和自升压写入技术,实现了0.27V至1V的宽电压读取,解决了传统ReRAM在低电压下读取速度慢和写入效率低的问题。
Ting-Chin Yang1, Wen-Chao Shen1, Ya-Chin King1, Chorng-Jung Lin1, Ku-Feng Lin2, Yu-Der Chih2, Sreedhar Natarajan2, Jonathan Chang2 National Tsing Hua University, Hsinchu, Taiwan, 2TSMC, Hsinchu, Taiwan 1 Resistive RAM (ReRAM) is a promising nonvolatile memory with low write energy, logic-process compatibility, and compact cell area. The 1T1R ReRAM [1-3] fits embedded applications requiring fast read (RD) access time (TAC) and low RD-VDDMIN, particularly for devices powered by batteries or energy harvesters. The cross-point ReRAM [4-6] is meant for high capacities with high RD-VDDMIN and slow TAC. As devices shrink, ReRAMs have higher cell resistance (R) and greater variations in write time and R, which reduces the R-ratio (RH/RL) between the high-R state (HRS, RH) and low-R state (LRS, RL). ReRAM also have a high RL, which enables a larger voltage drop across ReRAM to reduce write voltage and cell-switch (CS) size. Thus, ReRAM macro designs suffer: (1) small
Meng-Fan Chang1, Jui-Jen Wu1, Tun-Fei Chien1, Yen-Chen Liu1,