A Heterogeneous 3D-IC Consisting of Two 28nm FPGA Die and 32 Reconfigurable High-Performance Data Converters

📋 论文概要

本文提出一种异构3D-IC，将两个28nm FPGA芯片与32个可重构高性能数据转换器集成在一起，解决了传统分立数据转换器接口带宽瓶颈问题，实现了高带宽、高集成度的数据转换与处理。

💡 主要创新点

• 首次在28nm工艺上实现包含两个FPGA芯片和32个数据转换器的异构3D-IC，通过垂直堆叠减少IO接口功耗和延迟。
• 数据转换器可重构，支持多种采样率和分辨率，适应不同应用场景，提升系统灵活性。
• 采用3D集成技术将模拟和数字电路紧密耦合，显著提高系统带宽和能效。

🏷 关键词

📄 原文摘要

Aidan Keady1, John McGrath1, Edward Cullen1, Daire Breathnach1, Denis Keane1, Patrick Lynch1, Marites De La Torre1, Ronnie De La Torre1, Peng Lim1, Anthony Collins1, Brendan Farley1, Liam Madden2 Xilinx, Dublin, Ireland, 2Xilinx, San Jose, CA 1 Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing channel count and higher sample rate means this IO interface is becoming a limiting factor in the system budget with respect to interconnect complexity and associated power. The integration of flexible data converters with FPGA eliminates this IO cost and also offers a dynamically scalable, power efficient platform solution that addresses diverse application needs.

👥 作者与机构

Christophe Erdmann1, Donnacha Lowney1, Adrian Lynam1,