An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper

📋 论文概要

提出了一种超薄柔性CMOS应力传感器，并演示于自适应机器人抓手上，解决了机械应力对信号处理电路压阻效应的影响问题。

💡 主要创新点

• 首次将超薄CMOS芯片技术用于柔性应力传感器，实现与机器人抓手的集成
• 在HySiF混合系统框架下，通过设计补偿应力对模拟和数字电路的影响

🏷 关键词

📄 原文摘要

IMS CHIPS, Stuttgart, Germany 1 3 Hybrid Systems-in-Foil (HySiF) are becoming important for wearable electronics, medical diagnostics and flexible displays, which require mechanical flexibility or adaptivity as well as large area [1]. Ultra-thin chips are an essential part of HySiF as they allow for analog signal processing or complex digital controllers using well established CMOS technology. However, the effect of mechanical stress on the signal processing circuitry (piezoresistivity) has to be considered during the top-to-bottom design in order to realize stress insensitive analog and digital operation. On the other hand, for sensing mechanical stress on the same substrate, the stress effect needs to be maximized [2], thus leading to conflicting design requirements. In this work, an ultra-thin (20μm), bendable stress sensor with 2x10b digital outputs is presented. In contrast to rigid sensors, the stress cannot be avoided

👥 作者与机构

Yigit Mahsereci1, Stefan Saller2, Harald Richter3, Joachim Burghartz3

University of Stuttgart, Stuttgart, Germany, 2Festo, Esslingen, Germany,