A 4×20Gb/s WDM Ring-Based Hybrid CMOS Silicon Photonics Transceiver

📋 论文概要

该论文提出了一种基于WDM环的4×20Gb/s混合CMOS硅光子收发器，解决了短距离光链路中高带宽和低成本的需求。通过集成硅光子器件和CMOS电子电路，实现了高聚合收发器带宽。

💡 主要创新点

• 采用WDM环结构实现4通道20Gb/s的并行光收发，提高了带宽密度。
• 混合集成CMOS电子电路与硅光子器件，降低了系统成本和功耗。
• 通过优化环谐振器设计，实现了低串扰和高消光比。

🏷 关键词

📄 原文摘要

Peter Verheyen1, Mark Ingels1, Hongtao Chen1,3, Jeroen De Coster1, Guy Lepage1, Brad Snyder1, Kristin De Meyer1,2, Michiel Steyaert2, Nicola Pavarelli4, Jun Su Lee4, Peter O’Brien4, Philippe Absil1, Joris Van Campenhout1 imec, Leuven, Belgium, 2KU Leuven, Leuven, Belgium, imec - Ghent University, Ghent, Belgium, 4 Tyndall National Institute, Cork, Ireland 1 3 Silicon photonics (SiPh) has been identified as a prime technology targeting cost-effective short-range optical links [1]. Wavelength-division multiplexing (WDM) is an attractive approach for enabling high aggregate transceiver bandwidth without increasing the number of optical fibers used in the link. Ring-based optical modulators and wavelength-selective filters are attractive devices for scalable WDM SiPh transceivers owing to their compact footprint and moderate power required for thermal tuning. In this paper, we report on a thermally controlled ring-based flip-chip integrated CMOS-SiPh transceiver with

👥 作者与机构

Michal Rakowski1,2, Marianna Pantouvaki1, Peter De Heyn1,