⚡ 本页包含 AI 生成的分析内容，仅供参考
该论文介绍了IBM在22nm SOI工艺上设计的下一代System z微处理器，解决了高性能企业级计算中的功耗、频率和可靠性挑战。通过创新的电路设计和架构优化，实现了显著的性能提升和能效改进。
Donald Plass2, Yuen Chan2, Sean Carey2, Gerard Salem4, Friedrich Schroeder5, Frank Malgioglio2, Guenter Mayer5, Christopher Berry2, Michael Wood2, Yiu-Hing Chan2, Mark Mayo2, John Isakson3, Charudhattan Nagarajan6, Tobias Werner5, Leon Sigal7, Ricardo Nigaglioni3, Mark Cichanowski3, Jeffrey Zitz8, Matthew Ziegler7, Tim Bronson3, Gerald Strevig3, Daniel Dreps3, Ruchir Puri7, Douglas Malone2, Dieter Wendel5, Pak-Kin Mak2, Michael Blake2 IBM Systems and Technology, Yorktown Heights, NY, IBM Systems and Technology, Poughkeepsie, NY, 3 IBM Systems and Technology, Austin, TX, 4 IBM Systems and Technology, Williston, VT, 5 IBM Systems and Technology, Boeblingen, Germany, 6 IBM Systems and Technology, Bangalore, India, 7 IBM Research, Yorktown Heights, NY, 8 IBM Systems and Technology, Hopewell Junction, NY 1 2 The next-generation System z design introduces a new microprocessor chip (CP) and a system controller chip (SC) aimed at providing a substantial boost to
James Warnock1, Brian Curran2, John Badar3, Gregory Fredeman2,