⚡ 本页包含 AI 生成的分析内容,仅供参考
本文提出了一种像素间距匹配的超声接收器,用于3D光声成像,通过集成Delta-Sigma波束形成器在CMOS衬底上实现密集信号处理,解决了传统2D换能器阵列高通道数导致的电缆接口瓶颈问题。该设计实现了片上数据压缩,减少了数据输出量。
in medical ultrasound rely on 3D volumetric imaging, calling for dense 2D transducer arrays with thousands of elements. Due to this high channel count, the traditional per-element cable interface used for 1D arrays is no longer viable. To address this issue, recent work has proven the viability of flip-chip bonding [1] or direct transducer integration [2]. This shifts the burden to a CMOS substrate, which must provide dense signal conditioning and processing before the massively parallel image data can be pushed off chip. A common approach for data reduction is to employ subarray beamforming (BF), which applies delay and sum operations within a group of pixels. To implement such functionality within the tight pixel pitch, prior works have implemented the
Man-Chia Chen1, Aldo Peña Perez1, Sri-Rajasekhar Kothapalli1,
Philippe Cathelin2, Andreia Cathelin2, Sanjiv Sam Gambhir1, Boris Murmann1 Stanford University, Stanford, CA STMicroelectronics, Crolles, France 1 2 A variety of emerging applications