Single-Chip 3072ch 2D Array IC with RX Analog and All-Digital TX Beamformer for 3D Ultrasound Imaging

📋 论文概要

本文提出了一款单芯片3072通道2D阵列IC，集成了模拟接收和全数字发射波束形成器，用于3D超声成像。该芯片解决了传统超声系统中探头与主单元之间大量同轴电缆连接的问题，实现了高度集成化和小型化。

💡 主要创新点

• 单芯片集成3072个通道的2D阵列，极大提升了通道数，支持高分辨率3D成像。
• 采用全数字发射波束形成器（All-Digital TX Beamformer），相比模拟方式更灵活、可编程，且易于扩展。
• 在接收端集成模拟前端，实现了完整的RX模拟与TX数字波束形成一体化设计。

🏷 关键词

📄 原文摘要

Tatsuo Nakagawa2, Yasuyuki Okuma3, Yohei Nakamura2, Takahide Terada2, Yutaka Igarashi1, Taizo Yamawaki2, Toru Yazaki1, Yoshihiro Hayashi2, Kazuhiro Amino2, Takuya Kaneko2, Hiroki Tanaka2 Hitachi, Yokohama, Japan Hitachi, Kokubunji, Japan 3 Hitachi, Hatoyama, Japan 1 2 A diagnostic ultrasound (US) system transmits acoustic waves at several to tens of MHz into the human body for clinical purposes and detects the reflected waves to observe the internal organs without having a medical operation or radiation exposure. The system is composed of a main unit and probe connected via coaxial cables. The probe is very small because medical technicians laboriously grab and manipulate it for a long time. To avoid image obscurity depending on medical technicians, high-speed and high-resolution 3D/4D imaging is necessary. For this reason, several thousands of lead bulk piezoelectric material transducers (TD)

👥 作者与机构

Yusaku Katsube1, Shinya Kajiyama2, Takuma Nishimoto1,