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ISSCC 2017Session 27 · BIOMEDICAL CIRCUITSMedical & Bio

A 30.5mm3 Fully Packaged Implantable Device with Duplex Ultrasonic Data and Power Links Achieving 95kb/s with <10-4 BER at 8.5cm Depth

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📋 论文概要

该论文提出了一种全封装、体积仅为30.5mm³的植入式设备,利用超声波同时实现双向数据传输和功率传输。解决了微型植入设备在深部组织中可靠工作、提供闭环治疗所需双向通信以及支持多植入物网络的问题。

💡 主要创新点

核心指标
30.5mm³体积, 95kb/s数据速率, <10⁻⁴ BER
重要性
发表年份
ISSCC 2017

🏷 关键词

超声波植入式设备双向通信功率传输数据链路

📄 原文摘要

invasive miniaturized solutions that operate reliably at large depths, provide duplex communication for closed-loop therapies, and enable multi-access for a network of implants to gather information or provide systemic interventions. Using ultrasound (US), power and data can be efficiently transferred through the body as its wavelength at MHz is comparable to a mm-sized receiver, resulting in improved focusing, coupling, and acoustic-to-electrical conversion efficiency. Furthermore, thanks to the low propagation loss (~1dB/cm/MHz) and 7.2mW/mm2 safety limit, several mW of power is obtainable at the receiver, enabling highpower, complicated functionalities. While initial experiments using US for power transfer to implants have been successful [1,2], there is still a significant need to have reliable uplink data

👥 作者与机构

Ting Chia Chang, Max L. Wang, Jayant Charthad, Marcus J. Weber, Amin Arbabian

Stanford University, Stanford, CA The next generation of implantable medical devices focuses on minimally

分类:Medical & Bio · 年份:ISSCC 2017