← 返回论文列表 📄 下载原文 PDF  ISSCC 2017 · 3.2
ISSCC 2017Session 3 · DIGITAL PROCESSORSDigital Processors14nm LPP FinFET (Global Foundries)

Zen: A Next-Generation High-Performance x86 Core

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文介绍了AMD的下一代高性能x86核心'Zen',采用Global Foundries 14nm LPP FinFET工艺,在44mm²的Zen核心复合单元(CCX)中集成了4个核心和8MB共享L3缓存,每个核心包含0.5MB L2缓存、32KB L1数据缓存和64KB L1指令缓存,面向服务器、桌面和移动客户端应用。

💡 主要创新点

工艺节点
14nm LPP FinFET (Global Foundries)
重要性
发表年份
ISSCC 2017

🏷 关键词

Zen核心x86架构14nm FinFET

📄 原文摘要

Shane Southard1, Hugh McIntyre3, Amy Novak1, Stephen Kosonocky2, Ravi Jotwani1, Alex Schaefer1, Edward Chang2, Joshua Bell1, Michael Co1 AMD, Austin, TX AMD, Fort Collins, CO 3 AMD, Sunnyvale, CA 1 2 Codenamed “Zen”, AMD’s next-generation, high-performance x86 core targets server, desktop, and mobile client applications. Utilizing Global Foundries’ energyefficient 14nm LPP FinFET process, the 44mm² Zen core complex unit (CCX) has 1.4B transistors and contains a shared 8MB L3 cache and four cores (Fig. 3.2.7). The 7mm² Zen core contains a dedicated 0.5MB L2 cache, 32KB L1 data cache, and 64KB L1 instruction cache. Each core has a digital low drop-out (LDO) voltage regulator and digital frequency synthesizer (DFS) to independently vary frequency and voltage across power states. The scalable single Zen core combines both low power and high performance to replace AMD’s current two-core portfolio. The built-from-scratch Zen architecture

👥 作者与机构

Teja Singh1, Sundar Rangarajan1, Deepesh John1, Carson Henrion2,

分类:Digital Processors · 年份:ISSCC 2017