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该论文提出了一种采用40nm工艺的256K×44嵌入式RRAM宏单元,通过SL预充电读出放大器(SL-Precharge SA)和低压电流限制器(Low-Voltage Current Limiter)来改善读写性能,解决了RRAM读写操作中的速度和功耗问题。
due to the simplicity of the RRAM element (RE) and its compatibility with a logic process. A RRAM bit cell (Fig. 30.1.1) consists of an NMOS select transistor and a bipolar RE, which consists of a bottom electrode (BE), a transition metal-oxide file (Hi-K), a metal capping layer and a top electrode (TE). The memory cell operates as a 3-terminal device, including bit-line (BL), source-line (SL) and wordline (WL). BL is connecting to TE, SL is connecting to the source node of the select transistor and word-line (WL) is connecting to the gate of the select transistor. A common SL (CSL) architecture is adopted in this work. CSL allows two or more columns to share one source line. So that the column mux number for SL can be reduced, therefore macro area can be saved. In addition, SL can be
Chung-Cheng Chou, Zheng-Jun Lin, Pei-Ling Tseng, Chih-Feng Li,
Chih-Yang Chang, Wei-Chi Chen, Yu-Der Chih, Tsung-Yung Jonathan Chang TSMC, Hsinchu, Taiwan RRAM is an attractive and low-cost memory structure for embedded applications