← 返回论文列表 📄 下载原文 PDF  ISSCC 2018 · 5.8
ISSCC 2018Session 5 · IMAGE SENSORSImage Sensors65nm BSI

1Mpixel 65nm BSI 320MHz Demodulated TOF Image Sensor with 3.5μm Global Shutter Pixels and Analog Binning

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文提出了一款1M像素、65nm背照式(BSI)工艺的320MHz解调飞行时间(TOF)图像传感器,采用3.5μm全局快门像素和模拟合并技术,解决了高分辨率、低功耗、小尺寸3D深度相机的需求。

💡 主要创新点

核心指标
1M像素, 320MHz解调频率, 3.5μm像素尺寸, 全局快门
工艺节点
65nm BSI
重要性
发表年份
ISSCC 2018

🏷 关键词

飞行时间图像传感器全局快门模拟合并3D深度

📄 原文摘要

Stefan Wurster, Onur Akkaya, Andrew Payne, John Godbaz, Mike Fenton, Vijay Rajasekaran, Larry Prather, Satya Nagaraja, Vishali Mogallapu, Dane Snow, Rich McCauley, Mustansir Mukadam, Iskender Agi, Shaun McCarthy, Zhanping Xu, Travis Perry, William Qian, Vei-Han Chan, Prabhu Adepu, Gazi Ali, Muneeb Ahmed, Aditya Mukherjee, Sheethal Nayak, Dave Gampell, Sunil Acharya, Lou Kordus, Pat O'Connor Microsoft, Mountain View, CA The quest for accurate, high-resolution, low-power-consumption, and smallfootprint 3D depth cameras has driven a rapid improvement in Continuous-Wave (CW) Time-of-Flight (ToF) technology. Commercially available 3D image acquisition techniques include Stereo Vision, Structured Light, and ToF. CW ToF imaging systems offer excellent mechanical robustness, no baseline requirement, high effective depth image resolution, low computational cost, and simultaneous IR ambient light invariant intensity capture (Active Brightness). In a CW ToF

👥 作者与机构

Cyrus S. Bamji, Swati Mehta, Barry Thompson, Tamer Elkhatib,

分类:Image Sensors · 年份:ISSCC 2018