Integration of Photonics and Electronics

📋 论文概要

本文综述了光子集成电路（PIC）从电信向数据中心及其他领域扩展的趋势，强调了通用光子集成平台的重要性，通过分离设计与技术来降低应用门槛。

💡 主要创新点

• 提出通用光子集成平台的概念，将设计从特定工艺中解耦，促进多领域应用。
• 分析了PIC在短距离数据中心和高带宽通信中的主导地位，并预测其向其他领域的扩展。
• 强调了标准化平台对降低技术壁垒和加速产业化的关键作用。

🏷 关键词

📄 原文摘要

photonic integrated circuits (PICs) is rapidly growing. Photonic integration which is now the dominant technology in high-bandwidth and longdistance telecommunications is increasingly applied to shorter distances within data centers. Now, it is set to become also dominant in many other fields: PICs offer compelling performance advances in terms of precision, bandwidth, and energy efficiency. To enable uptake in new sectors, the availability of highly standardized (generic) photonic-integration-platform technologies is of key importance, as this separates design from technology, reducing barriers for new entrants. Another major challenge is low-cost energy-efficient integration of photonics with the electronic circuitry that is used for driving and controlling

👥 作者与机构

Meint Smit,

with Kevin Williams, Jos van der Tol Institute for Photonic Integration (formerly COBRA Institute), Eindhoven University of Technology, Eindhoven, The Netherlands Preamble The market for