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ISSCC 2019Session 13 · NON-VOLATILE MEMORIESMemory

A 1.33Tb 4-bit/Cell 3D-Flash Memory on a 96-Word-LineLayer Technology

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文提出了一种基于96字线层技术的1.33Tb 4-bit/单元3D NAND闪存,通过增加层数和每单元存储位数大幅提升存储密度和容量,满足大容量存储需求。

💡 主要创新点

核心指标
1.33Tb容量,4-bit/cell
重要性
发表年份
ISSCC 2019

🏷 关键词

3D NAND闪存QLC96字线层高容量存储

📄 原文摘要

M. Miakashi1, Y. Nagadomi1, T. Nakano1, T. Kawabe1, T. Shibuya1, M. Sako1, K. Yanagidaira1, T. Hashimoto1, H. Date1, M. Sato1, T. Nakagawa1, H. Takamoto1, J. Musha1, T. Minamoto1, M. Uda1, D. Nakamura1, K. Sakurai1, T. Yamashita1, J. Zhou1, R. Tachibana1, T. Takagiwa1, T. Sugimoto1, M. Ogawa1, Y. Ochi1, K. Kawaguchi1, M. Kojima1, T. Ogawa1, T. Hashiguchi1, R. Fukuda1, M. Masuda1, K. Kawakami1, T. Someya1, Y. Kajitani1, Y. Matsumoto1, N. Morozumi1, J. Sato1, N. Raghunathan2, Y. L. Koh2, S. Chen2, J. Lee2, H. Nasu2, H. Sugawara2, K. Hosono1, T. Hisada1, T. Kaneko1, H. Nakamura1 Toshiba Memory, Yokohama, Japan Western Digital, Milpitas, CA 1 2 Since 3D-Flash memory took over for 2D-Flash memory, chip capacity has continuously improved [1-3]. In the 2D-Flash era, 2b/cell (MLC) offered higher performance and reliability, while a 3b/cell (TLC) offered the lowest cost. Thanks to a larger feature size, 3D Flash cell reliability is much better than that of 2D. As a

👥 作者与机构

N. Shibata1, K. Kanda1, T. Shimizu1, J. Nakai1, O. Nagao1, N. Kobayashi1,

分类:Memory · 年份:ISSCC 2019