⚡ 本页包含 AI 生成的分析内容,仅供参考
本文提出了一种基于96字线层技术的1.33Tb 4-bit/单元3D NAND闪存,通过增加层数和每单元存储位数大幅提升存储密度和容量,满足大容量存储需求。
M. Miakashi1, Y. Nagadomi1, T. Nakano1, T. Kawabe1, T. Shibuya1, M. Sako1, K. Yanagidaira1, T. Hashimoto1, H. Date1, M. Sato1, T. Nakagawa1, H. Takamoto1, J. Musha1, T. Minamoto1, M. Uda1, D. Nakamura1, K. Sakurai1, T. Yamashita1, J. Zhou1, R. Tachibana1, T. Takagiwa1, T. Sugimoto1, M. Ogawa1, Y. Ochi1, K. Kawaguchi1, M. Kojima1, T. Ogawa1, T. Hashiguchi1, R. Fukuda1, M. Masuda1, K. Kawakami1, T. Someya1, Y. Kajitani1, Y. Matsumoto1, N. Morozumi1, J. Sato1, N. Raghunathan2, Y. L. Koh2, S. Chen2, J. Lee2, H. Nasu2, H. Sugawara2, K. Hosono1, T. Hisada1, T. Kaneko1, H. Nakamura1 Toshiba Memory, Yokohama, Japan Western Digital, Milpitas, CA 1 2 Since 3D-Flash memory took over for 2D-Flash memory, chip capacity has continuously improved [1-3]. In the 2D-Flash era, 2b/cell (MLC) offered higher performance and reliability, while a 3b/cell (TLC) offered the lowest cost. Thanks to a larger feature size, 3D Flash cell reliability is much better than that of 2D. As a
N. Shibata1, K. Kanda1, T. Shimizu1, J. Nakai1, O. Nagao1, N. Kobayashi1,