⚡ 本页包含 AI 生成的分析内容，仅供参考
该论文探讨了在数据量爆炸式增长背景下，半导体行业面临的缩放挑战。作者提出需要重新思考传统摩尔定律，强调技术多样化和系统与技术的协同创新。
In a smart society where everything will be connected, an avalanche of data is coming toward us, with numbers going to several hundreds of zettabytes per year by 2025! This data will need to be distributed, stored, computed, and analyzed to glean its most valuable information. At the heart of it will be innovations at the technology level, but also on the system side. With Moore’s Law under pressure, a rethinking of what the semiconductor industry calls scaling will be needed. In this paper, we will show that there is a strong push to technology diversification, blending different technologies together to achieve benefits at the system level. This brings the interaction of technology and design to the next level: system-technology co-optimization (STCO), with 3D technologies taking a central stage. Furthermore, the growing demand for storage will put an increasing pressure on the memory hierarchy where emerging concepts like MRAM, FeFET,
Program Director, imec, Leuven, Belgium, 1.0 Abstract