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ISSCC 2020Session 2 · PROCESSORSDigital Processors7nm FinFET

A 7nm FinFET 2.5GHz/2.0GHz Dual-Gear Octa-Core CPU Subsystem with Power/Performance Enhancements for a Fully Integrated 5G Smartphone SoC.

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📋 论文概要

该论文介绍了一款采用7nm FinFET工艺的集成5G移动SoC中的异构CPU子系统,通过电路技术优化实现了2.5GHz/2.0GHz双频八核CPU的功率/性能提升,解决了高性能与低功耗的平衡问题。

💡 主要创新点

工艺节点
7nm FinFET
重要性
发表年份
ISSCC 2020

🏷 关键词

7nm FinFET八核CPU双频功率/性能优化5G SoC

📄 原文摘要

Gordon Gammie1, Hsinchen Chen1, Lee-Kee Yong1, Manzur Rahman1, Jenny Wiedemeier1, Ramu Madhavaram1, Alex Chiou2, Blundt Li2, Vincent Lin2, Rory Huang2, Michael Yang2, Achuta Thippana1, Osric Su2, SA Huang2 MediaTek, Austin, TX MediaTek, Hsinchu, Taiwan 1 2 This paper introduces the heterogenous CPU complex of a fully integrated 5G mobile Smartphone SoC, implemented in 7nm FinFET technology. Circuit techniques developed to achieve competitive CPU PPA are detailed, and associated silicon results are presented. As shown in Fig. 2.5.1, the SoC integrates a 5G modem that suports 4.7Gb/s download speeds and 2.5Gb/s upload speeds in sub-6GHz bands. Multimode support for 2G, 3G, 4G, and 5G are provided, and 5G supports both Standalone and non-Standalone modes. The latest ARM Cortex-A77 CPU and Mali G77 GPU are integrated, along with a new generation in-house APU for AI processing. Multimedia and Imaging supports 4K video encode/decode at 60fps and cameras

👥 作者与机构

Hugh Mair1, Ericbill Wang2, Ashish Nayak1, Rolf Lagerquist1, Loda Chou2,

分类:Digital Processors · 年份:ISSCC 2020