← 返回论文列表 📄 下载原文 PDF  ISSCC 2020 · 2.6
ISSCC 2020Session 2 · PROCESSORSDigital Processors16nm

A 16nm 3.5B+ Transistor >14TOPS 2-to-10W Multicore SoC Platform for Automotive and Embedded

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文提出一款基于16nm工艺的多核SoC平台,集成超过35亿晶体管,提供超过14TOPS的算力,功耗范围2-10W,面向汽车和嵌入式应用。该平台整合了安全MCU、512位向量VLIW DSP以及嵌入式视觉与成像加速单元,旨在满足高算力、低功耗和功能安全的严苛需求。

💡 主要创新点

核心指标
>14TOPS @ 2-10W, 3.5B+ transistors
工艺节点
16nm
重要性
发表年份
ISSCC 2020

🏷 关键词

多核SoC汽车电子嵌入式视觉VLIW DSP安全MCU

📄 原文摘要

VLIW DSP, Embedded Vision and Imaging Acceleration Rama Venkatasubramanian1, Don Steiss1, Greg Shurtz2, Tim Anderson1, Kai Chirca1, Raghavendra Santhanagopal1, Niraj Nandan1, Anish Reghunath1, Hetul Sanghvi1, Daniel Wu1, Abhijeet Chachad1, Brian Karguth1, Denis Beaudoin1, Charles Fuoco1, Lewis Nardini1, Chunhua Hu1, Sam Visalli1, Amrit Mundra1, Devanathan Varadarajan1, Frank Cano2, Shane Stelmach1, Mihir Mody3, Arthur Redfern1, Haydar Bilhan1, Maher Sarraj1, Ali Siddiki1, Anthony Lell1, Eldad Falik1, Anthony Hill1, Abhinay Armstrong1, Todd Beck1, Vijay Kanumuri1, Steve Mullinnix1, Darnell Moore1, Jason Jones2, Manoj Koul1, Sanjive Agarwala1 Texas Instruments, Dallas, TX, 2Texas Instruments, Houston, TX Texas Instruments, Bangalore, India 1 3 The 7th generation Jacinto™ SoC platform is an evolution of prior architectures [1,2] and integrates new capabilities to support a wide set of applications,

👥 作者与机构

Applications with Integrated Safety MCU, 512b Vector

分类:Digital Processors · 年份:ISSCC 2020