← 返回论文列表 📄 下载原文 PDF  ISSCC 2020 · 7.1
ISSCC 2020Session 7 · HIGH-PERFORMANCE MACHINE LEARNINGAI / ML7nm

A 3.4-to-13.3TOPS/W 3.6TOPS Dual-Core Deep-Learning Accelerator for Versatile AI Applications in 7nm 5G Smartphone SoC

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

该论文提出了一款用于5G智能手机的双核深度学习加速器,采用7nm工艺,实现了3.4至13.3 TOPS/W的能效和3.6 TOPS的性能,旨在满足多种AI应用对实时性和能效的严苛要求。

💡 主要创新点

核心指标
3.4-13.3 TOPS/W 能效, 3.6 TOPS 性能
工艺节点
7nm
重要性
发表年份
ISSCC 2020

🏷 关键词

深度学习加速器双核架构5G智能手机高能效7nm工艺

📄 原文摘要

Yu-Ting Kuo, Perry H Wang, Pei-Kuei Tsung, Jeng-Yun Hsu, Wei-Chih Lai, Chia-Hung Liu, Shao-Yu Wang, Chin-Hua Kuo, Chih-Yu Chang, Ming-Hsien Lee, Tsung-Yao Lin, Chih-Cheng Chen MediaTek, Hsinchu, Taiwan Recent advancements in deep learning (DL) have led to the wide adoption of AI applications, such as image recognition [1], image de-noising and speech recognition, in the 5G smartphones. For a satisfactory user experience, there are stringent requirements in the real-time response of smartphone applications. In order to meet the performance expectations for DL, numerous deep learning accelerators (DLA) have been proposed for DL inference on the edge devices [25]. As depicted in Fig. 7.1.1, the major challenge in designing a DLA for smartphones is achieving the required computing efficiency, while limited by the power budget and memory bandwidth (BW). Since the overall power consumption of a smartphone system-on-a-chip (SoC) is usually constrained to 2 to 3W and

👥 作者与机构

Chien-Hung Lin, Chih-Chung Cheng, Yi-Min Tsai, Sheng-Je Hung,

分类:AI / ML · 年份:ISSCC 2020