A 1.7pJ/b 112Gb/s XSR Transceiver for Intra-Package Communication in 7nm FinFET Technology

📋 论文概要

本文提出了一款采用7nm FinFET工艺的112Gb/s极短距离（XSR）收发器，用于封装内通信，能效为1.7pJ/b。该设计解决了高带宽密度和低功耗需求，适用于数据中心和芯片间互连。

💡 主要创新点

• 采用7nm FinFET工艺实现112Gb/s单通道数据率，同时保持1.7pJ/b的超低能耗。
• 针对封装内极短距离信道优化收发器架构，可能包括均衡和时钟恢复技术以克服信道损耗。

🏷 关键词

📄 原文摘要

Mohammad Elbadry1, Ahmed ElShater1, Tsz-Bin Liu2, Joonyeong Lee1, Dhinessh Ramachandran1, Kaiz Wang2, Chih-Hao Weng2, Mau-Lin Wu2, Tamer Ali1 MediaTek, Irvine, CA MediaTek, Hsinchu, Taiwan 1 2 *Equally-Credited Authors (ECAs) COVID-19 sparked a paradigm shift for businesses, education, and social life. The measures taken have emphasized, more than ever, the importance of on-line communication platforms. Online streaming services, education tools, and workplace communication tools all experienced a multifold increase in demand in 2020 as the world population was under a lockdown. Service providers’ ability to meet these demands relies on the capacity of mega-scale data centers (MSDC). Hence, capacity and bandwidth of MSDCs are expected to grow exponentially. The transition from 12.8 to 51.2Tb/s switches for data centers leaf and spine is underway, and is expected to deploy starting in 2021~2022 [1]. Unfortunately, the increase of switch throughput comes with

👥 作者与机构

Ramy Yousry*1, Ehung Chen*1, Yu-Ming Ying1, Mohammed Abdullatif1,