A 1/2.3inch 12.3Mpixel with On-Chip 4.97TOPS/W CNN Processor Back-Illuminated Stacked CMOS Image Sensor

📋 论文概要

该论文提出了一款集成片上CNN处理器的背照式堆叠CMOS图像传感器，像素为12.3Mp，尺寸为1/2.3英寸，能效达4.97TOPS/W。它解决了边缘AI设备中云计算带来的延迟、通信成本和隐私问题。

💡 主要创新点

• 将CNN处理器直接集成在图像传感器芯片上，实现边缘端实时AI处理。
• 采用背照式堆叠结构，在保持高像素密度的同时提升感光性能和集成度。
• 实现了4.97TOPS/W的高能效，适合低功耗边缘应用。

🏷 关键词

📄 原文摘要

Hareesh Gowtham2, Hidetomo Nakanishi2, Edan Almog3, Yoel Livne3, Gadi Yuval3, Eli Zyss3, Takashi Izawa2 Sony Semiconductor Solutions, Tokyo, Japan Sony Semiconductor Solutions, Atsugi, Japan 3 Sony Semiconductor Israel, Hod-Hasharon, Israel 1 2 Within the Internet of Things (IoT) market, retail, smart city, and so on, the need for camera products which have Artificial Intelligence (AI) processing capabilities is growing. AI processing capability on such edge devices solves some issues of cloud-only computing systems, such as latency, cloud communication, processing cost, and privacy concerns. The market demand for smart cameras with AI processing capabilities includes small size, low cost, low power and ease of installation. However, conventional CMOS Image Sensors (CIS) only output the raw data of the captured image. Therefore, when developing a smart camera that has AI processing capabilities, it is necessary to

👥 作者与机构

Ryoji Eki1, Satoshi Yamada2, Hiroyuki Ozawa1, Hitoshi Kai1, Kazuyuki Okuike2,