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ISSCC 2022Session 11 · COMPUTE-IN-MEMORY AND SRAMAI / ML28nm

A 1.041-Mb/mm2 27.38-TOPS/W Signed-INT8 Dynamic-LogicBased ADC-less SRAM Compute-In-Memory Macro in 28nm with Reconfigurable Bitwise Operation for AI and Embedded Applications

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文提出了一种基于动态逻辑的无ADC SRAM存内计算宏,在28nm工艺下实现了1.041 Mb/mm²的高密度和27.38 TOPS/W的高能效,支持有符号INT8向量-矩阵乘法。该设计通过去除传统ADC和静态逻辑,显著减少了计算电路面积,适用于深度神经网络推理等高效能嵌入式系统。

💡 主要创新点

核心指标
27.38 TOPS/W @ 1.041 Mb/mm²
工艺节点
28nm
重要性
发表年份
ISSCC 2022

🏷 关键词

SRAM存内计算ADC-less动态逻辑INT8高能效

📄 原文摘要

China 4 Duke University, Durham, NC 1 2 Advanced intelligent embedded systems perform cognitive tasks with highly-efficient vector-processing units for deep neural network (DNN) inference and other vector-based signal processing using limited power. SRAM-based compute-in-memory (CIM) achieves high energy efficiency for vector-matrix multiplications, offers <1ns read/write speed, and saves vastly repeating memory accesses. However, prior SRAM CIM macros require a large area for compute circuits (either using ADC for analog CIM [1-4] or CMOS static logic for all-digital CIM [5-6]), have limited CIM functions, and use fixed vectorprocessing dimensions that cause a low-spatial-utilization rate when deploying DNN (Fig.

👥 作者与机构

Bonan Yan1, Jeng-Long Hsu2, Pang-Cheng Yu2, Chia-Chi Lee2, Yaojun Zhang3,

Wenshuo Yue1, Guoqiang Mei3, Yuchao Yang1, Yue Yang2, Hai Li4, Yiran Chen4, Ru Huang1 Peking University, Beijing, China NeoNexus, Singapore, Singapore 3 Pimchip Technology, Beijing,

分类:AI / ML · 年份:ISSCC 2022