⚡ 本页包含 AI 生成的分析内容,仅供参考
该论文提出了一种在40nm工艺下集成了RRAM和SRAM的存算一体系统,包含嵌入式Cortex M3微处理器,实现了60.64TOPS/W的高能效,并具备ECC纠错能力。解决了存算一体系统中的可靠性、能效和处理器集成问题。
Muya Chang1, Samuel D. Spetalnick1, Brian Crafton1, Win-San Khwa2, Yu-Der Chih3, Meng-Fan Chang2, Arijit Raychowdhury1 In Fig. 16.3.4, we illustrate physical design considerations, power plan, software programmability, and the testing procedure. Due to the considerable number of RRAM modules, proper physical design becomes critical in terms of power delivery, balanced delay, and routing congestion. To minimize the routing congestion and balance the delay between the Cortex M3 and all the RRAM modules, placing the microprocessor at the center of the chip turned out to be the best solution. To minimize the IR drop and get the best power delivery, multiple hierarchical power rings/stripes and layers as listed in the table are used. In addition, multiple voltage domains are separated for cleaner power delivery and measuring power consumption for each functional block. To provide a simple and complete platform, a complete application programming interface (API) is
(5) Lastly, victim BLs are tracked with a status register and regularly refreshed to combat, resistance drift and variation.