← 返回论文列表 📄 下载原文 PDF  ISSCC 2023 · 1.3
ISSCC 2023Session 1 · PLENARYPlenary

EU Chips Act Drives Pan-European Full-Stack Innovation Partnerships Jo De Boeck

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文介绍了欧洲芯片法案对泛欧全栈创新合作伙伴关系的推动,分析了半导体对生活和社会的重要影响以及供应链和地缘政治带来的挑战,并探讨了欧洲在半导体价值链中的重新定位策略。

💡 主要创新点

重要性
发表年份
ISSCC 2023

🏷 关键词

欧洲芯片法案全栈创新半导体供应链

📄 原文摘要

Germany 1. The Impact of Semiconductors and the European Chips Act In every aspect of our life and society, semiconductors play a major role and that impact is set to increase even further. The pandemic in conjunction with supply chain hiccups and geopolitical tensions made all regions realize that they need to revisit their position and potential in the semiconductor value chain. The European Commission expressed

👥 作者与机构

imec and KU Leuven, Leuven, Belgium, Jean-René Lèquepeys

CEA-Leti and Université Grenoble Alpes, Grenoble, France Christoph Kutter Fraunhofer EMFT and Universität der Bundeswehr, Munich,

分类:Plenary · 年份:ISSCC 2023