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ISSCC 2023Session 13 · IDEAS FOR THE FUTUREAI / ML

Crystalline Oxide Semiconductor-based 3D Bank Memory System for Endpoint Artificial Intelligence with Multiple Neural Networks Facilitating Context Switching and Power Gating the maximum frequency. Energy for inference (MNIST) using only the CPU memory and the core is 1681.97µJ, whereas energy for inference using the ACC is 0.19µJ. The inference time is reduced from 3.55s to 485µs. Therefore, our ACC enables inference according to the frame rate of imaging data (e.g., 60fps and 16ms).

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

该论文提出了一种基于晶体氧化物半导体的3D存储体系统,用于端点人工智能,通过堆叠OS存储器和CMOS电路实现上下文切换和功耗降低。与传统的SRAM芯片相比,该方案在推理任务中显著降低了待机功耗。

💡 主要创新点

重要性
发表年份
ISSCC 2023

🏷 关键词

晶体氧化物半导体3D存储体端点人工智能低功耗上下文切换

📄 原文摘要

Masashi Fujita1, Munehiro Kozuma1, Yoshinori Ando1, Yoshiyuki Kurokawa1, Toru Nakura2, Shunpei Yamazaki1 The effect of power reduction when performing context switching and PG is compared between an OS/Si chip and a Si (SRAM) chip, as shown in Fig. 13.1.4. The OS/Si chip is fabricated by stacking only one layer of OS memory on a CMOS circuit. The Si chip does not use OS and the ACC consists of PEs and SRAM. Since the SRAM is volatile memory, the Si chip reduces standby power by clock gating (CG). The power of these chips is estimated under intermittent operations in which the inference is performed while switching two NNs, and then, PG (CG) is performed. The OS/Si and Si chips (estimated based on the SRAM generator) can only retain data for one NN in the ACC memory. Thus, every inference requires weight data rewriting. The stacked OS/OS/Si process enables instant context switching and results in low power by allocating the time for PG. At room

👥 作者与机构

Yuto Yakubo1, Kazuma Furutani1, Kouhei Toyotaka1, Haruki Katagiri1,

分类:AI / ML · 年份:ISSCC 2023