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本文介绍了AMD的Zen 4 x86-64微处理器核心,采用5nm FinFET工艺制造,通过与台积电的紧密合作优化了工艺和缩放性能。该核心相比上一代Zen 3在7nm工艺上实现了显著的性能提升。
Brett Johnson2, Russell Schreiber3, Carson Henrion2, Kevin Gillespie1, Tom Burd4, Harry Fair1, David Johnson2, Jonathan White1, Scott McLelland1, Steven Bakke1, Javin Olson1, Ryan McCracken1, Matthew Pickett2, Aaron Horiuchi2, Hien Nguyen1, Tim H Jackson2 AMD, Boxborough, MA AMD, Fort Collins, CO 3 AMD, Austin, TX 4 AMD, Santa Clara, CA 1 2 “Zen 4” is AMD’s next generation x86-64 microprocessor core, fabricated in a 5nm FinFET process. Close collaboration between the design team and TSMC enabled an optimized process and excellent process scaling relative to the 7nm process used for “Zen 3” [1]. The 55mm2 core complex (CCX), shown in Fig. 2.1.1, contains 6.5B transistors across eight cores, similar to the 8 core CCX in the previous generation. Each core includes a 1MB private L2 cache, double the previous generation, and the eight cores share a 32MB L3 cache. The design also delivers a process-neutral performance
Benjamin Munger1, Kathy Wilcox1, Jeshuah Sniderman1, Chuck Tung1,