← 返回论文列表 📄 下载原文 PDF  ISSCC 2023 · 28.7
ISSCC 2023Session 28 · HIGH-DENSITY MEMORIES AND HIGH-SPEED INTERFACERF & Wireless

A 1.1V 6.4Gb/s/pin 24-Gb DDR5 SDRAM with a Highly-Accurate Duty Corrector and NBTI-Tolerant DLL

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文提出了一款1.1V供电、6.4Gb/s/pin数据速率、24Gb容量的DDR5 SDRAM,通过高精度占空比校正器和抗NBTI的DLL设计,解决了高速低功耗下PVT敏感性问题,实现了高密度与高速接口。

💡 主要创新点

核心指标
6.4Gb/s/pin @ 1.1V, 24Gb容量
重要性
发表年份
ISSCC 2023

🏷 关键词

DDR5 SDRAM占空比校正器DLLNBTI容忍高速接口

📄 原文摘要

Junsub Yoon, Jungmin Choi, Sanguk Lee, Hyunsub Norbert Rie, Jin-il Lee, Jongbum Lee, Taeseong Jang, JunHyung Kim, Sanghee Kang, Jungbum Shin, Yanggyoon Loh, Chang Yong Lee, Junmyung Woo, Hyeseung Yu, Changhyun Bae, Reum Oh, Young-soo Sohn, Changsik Yoo, Jooyoung Lee Samsung Electronics, Hwaseong, Korea The need for high-quality multi-media data increases the amount of data to be stored and processed, necessitating DDR5 to achieve high-density and high-speed with lowpower consumption [1]. However, high-speed with low-power operation makes DRAM more vulnerable to process-voltage-temperature (PVT) variations, negative-bias thermal instability (NBTI), etc. In this work, a mono-die based 24-Gb high-density DDR5 achieving 6.4Gbps/pin is implemented. To lower power consumption, GIO switching is reduced by using a GIO separation switch and a read-only GIO pre-charge scheme. The proposed DRAM has a higher tolerance to NBTI, since the delay-locked loop (DLL)

👥 作者与机构

Daehyun Kwon, Heon Su Jeong, Jaemin Choi, Wijong Kim, Jae Woong Kim,

分类:RF & Wireless · 年份:ISSCC 2023