← 返回论文列表 📄 下载原文 PDF  ISSCC 2023 · 29.9
ISSCC 2023Session 29 · DIGITAL ACCELERATORS AND CIRCUIT TECHNIQUESDigital Circuits22nm FDSOI

An 8T eNVSRAM Macro in 22nm FDSOI Standard Logic with Simultaneous Full-Array Data Restore for Secure IoT Devices

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文提出了一种8T eNVSRAM宏单元,在22nm FDSOI标准逻辑工艺中实现,旨在解决超低功耗IoT设备在待机时的高泄漏能耗问题。该设计通过同时全阵列数据恢复功能,在电源关闭前快速保存数据,并兼容标准CMOS逻辑工艺,无需额外制造步骤。

💡 主要创新点

工艺节点
22nm FDSOI
重要性
发表年份
ISSCC 2023

🏷 关键词

8T eNVSRAM22nm FDSOI全阵列数据恢复超低功耗IoT安全

📄 原文摘要

There has been an increasing demand for ultra-low power IoT devices in recent years. These devices often have low activity rates and most of the time are in standby mode, resulting in a high leakage energy consumption. To reduce the leakage energy, the supply power can be turned off, but before doing so, data needs to be stored in a non-volatile memory (NVM). Also, many IoT devices are battery-operated or powered wirelessly and their data needs to be stored before a power-loss event. The conventional NVMs, such as EEPROM and FLASH, are not CMOS-logic compatible in terms of technology node and operating voltages. They also require extra fabrication steps, which increases the cost for IoT devices that use small memories. Furthermore, most NVMs are not embedded with logic. Embedding NVM with logic enables novel architectures, such as in-SRAM nonvolatile weight storage for compute-in-memory (nvCIM). To address these

👥 作者与机构

Sepideh Nouri, Subramanian S. Iyer

University of California, Los Angeles, CA

分类:Digital Circuits · 年份:ISSCC 2023