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ISSCC 2023Session 9 · HIGHLIGHTED CHIP RELEASESIndustry Highlights7nm CMOS

An In-depth Look at the Intel IPU E2000

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文介绍了Intel首款ASIC IPU设备E2000,这是一款与Google协同设计的200G产品,于2022年量产。该设备集成了丰富的包处理流水线、RDMA和NVMe存储卸载能力,以及基于ARM Neoverse的计算复合体,允许客户软件执行从复杂包处理到设备管理等多种功能,采用TSMC 7nm工艺。

💡 主要创新点

工艺节点
7nm CMOS
重要性
发表年份
ISSCC 2023

🏷 关键词

IPU包处理NVMe卸载ARM Neoverse7nm

📄 原文摘要

Processing Unit (Intel IPU) E2000 is Intel’s first ASIC IPU device, a 200G product co-designed with Google and in production as of 2022. It features a rich packet processing pipeline, RDMA and storage capability including NVMe offload and an ARM Neoverse based compute complex enabling customer provided software to execute features ranging from complex packet processing pipelines to storage transport to device management and telemetry. The device was fabricated in TSMC’s 7nm process. Utilizing the combination of general-purpose acceleration and software running in the compute complex, this IPU enables a rich variety of services to be provided to the attached client. Attached clients can range from compute hosts for providing

👥 作者与机构

Naru Sundar*1, Brad Burres*2, Yadong Li*3, Dave Minturn4, Brian Johnson4, Nupur Jain5

Intel, Santa Clara, CA Intel, Hudson, MA 3 Intel, Portland, OR 4 Intel, Hillsboro, OR 5 Intel, San Jose, CA *Equally Credited Authors (ECAs) 1 2 The Intel® Infrastructure

分类:Industry Highlights · 年份:ISSCC 2023