技术领域

Industry Highlights

7 篇相关论文 (2008–2026)

ISSCC 2023 Session 9 Industry Highlights
An In-depth Look at the Intel IPU E2000
Naru Sundar*1, Brad Burres*2, Yadong Li*3, Dave Minturn4, Brian Johnson4, Nupur Jain5
Processing Unit (Intel IPU) E2000 is Intel’s first ASIC IPU device, a 200G product co-designed with Google and in production as of 2022. It features a rich packet processing pipeline, RDMA and storage capability includin
ISSCC 2023 Session 9 Industry Highlights
NVLink-C2C: A Coherent Off Package Chip-to-Chip Interconnect with 40Gbps/pin Single-ended Signaling
Ying Wei1, Yi Chieh Huang2, Haiming Tang1, Nithya Sankaran1, Ish Chadha1,
systems, with 900GB/s link between Grace and Hopper, or between two Grace chips. The connection provides a unified, cache-coherent memory address space that combines system and HBM GPU memories for simplified programmabi
ISSCC 2023 Session 9 Industry Highlights
D1: A 7nm ML Training Processor with Wave Clock Distribution
Tim C. Fischer1, Anantha Kumar Nivarti1, Raghuvir Ramachandran1,
Ram Bharti1, Derek Carson1, Anton Lawrendra1, Vineet Mudgal1, Vivek Santhosh1, Sunil Shukla2, Te-Chen Tsai1 Tesla, Palo Alto, CA Tesla, Austin, TX 1 2 D1 is the ML training processor in the DOJO exa-scale computer system
ISSCC 2020 Session 8 Industry Highlights
Radeon RX 5700 Series: The AMD 7nm Energy-Efficient High-Performance GPUs
Sal Dasgupta1, Teja Singh2, Ashish Jain2, Samuel Naffziger3,
technology, the design of the Radeon RX 5700 series GPUs incorporate a 256b memory interface of GDDR6 memory operating at 14Gb/s for a total of 448GB/s bandwidth, a x16 PCIe® Gen4 link interface, and six 1.4 Display Port
ISSCC 2020 Session 8 Industry Highlights
A 3GHz ARM Neoverse N1 CPU in 7nm FinFET for Infrastructure Applications
Robert Christy1, Stuart Riches2, Sujil Kottekkat3, Prasanth Gopinath4,
Ketan Sawant3, Anitha Kona1, Rob Harrison3 ARM, Austin, TX ARM, Cambridge, United Kingdom 3 ARM, Sheffield, United Kingdom 4 ARM, Bangalore, India 1 2 The Neoverse family of Arm processors target a combination of high pe
ISSCC 2020 Session 8 Industry Highlights
A Versatile 7nm Adaptive Compute Acceleration Platform Processor
Prasun K. Raha, Tomai Knopp, Sagheer Ahmad, Ahmad Ansari,
Fu-Hing Ho, Thomas To, Vamsi Nalluri, Mrinal Sarmah, Rajeev Patwari Xilinx, San Jose, CA As benefits from Moore’s Law diminish [1], general-purpose compute platforms like CPUs and GPUs continue to become increasingly pow
ISSCC 2020 Session 8 Industry Highlights
Lakefield and Mobility Compute: A 3D Stacked 10nm and
22FFL Hybrid Processor System in 12×12mm2, 1mm, Package-on-Package
Wilfred Gomes1, Sanjeev Khushu2, Doug B. Ingerly1, Patrick N. Stover3, Nasirul I. Chowdhury1, Frank O'Mahony1, Ajay Balankutty1, Noam Dolev3, Martin G. Dixon1, Lei Jiang1, Surya Prekke4, Biswajit Patra4, Pavel V. Rott1,