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ISSCC 2024Session 13 · HIGH-DENSITY MEMORIES AND HIGH-SPEED INTERFACESRF & Wireless

A 25.2Gb/s/pin NRZ/PAM-3 Dual-Mode Transmitter with Embedded Partial DBI Achieving a 133% I/O Bandwidth/Pin Efficiency and 19.3% DBI Efficiency

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📋 论文概要

本文提出了一种25.2Gb/s/pin的NRZ/PAM-3双模发射器,通过嵌入式部分数据总线反转(DBI)技术,实现了133%的I/O带宽/引脚效率,解决了传统NRZ内存接口带宽受限的问题。

💡 主要创新点

核心指标
25.2Gb/s/pin, 133% I/O bandwidth/pin efficiency
重要性
发表年份
ISSCC 2024

🏷 关键词

双模发射器NRZPAM-3部分DBI高带宽内存接口

📄 原文摘要

*Equally Credited Authors (ECAs) The demand for high-bandwidth data communication in various data-centric applications has increased significantly. It requires many repetitive data transfers between processing units and off-chip memories, owing to the limited memory I/O bandwidth. This results in a deterioration in system throughput and energy efficiency. Therefore, an energyefficient and high-bandwidth memory interface is required. NRZ signaling [1,2] is commonly used in memory interfaces; however, it is difficult to increase the I/O bandwidth beyond a certain point owing to on-chip bandwidth limitations. PAM-4 signaling [3,4] increases the I/O bandwidth by transmitting 2b in 1UI. However, PAM-4 signaling has a reduced signal-to-noise ratio (SNR), which deteriorates further as the power supply voltage is scaled down. PAM-3 signaling [5,6] can alleviate the above problems because it can achieve better SNR than PAM-4 signaling and a higher I/O

👥 作者与机构

Chanheum Han*, Ki-Soo Lee*, Joo-Hyung Chae

Kwangwoon University, Seoul, Korea

分类:RF & Wireless · 年份:ISSCC 2024