An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction

📋 论文概要

本文提出了一种基于粘附性中间层的可重构多传感器贴片接口，集成了微尺度结构以实现舒适的压力式重构，能够根据不同应用需求轻松附着或拆卸传感器组件，解决了异构多传感器贴片设备的适应性难题。

💡 主要创新点

• 提出了基于粘附性中间层的可重构贴片概念，利用集成微结构实现传感器组件的按需附着与拆卸。
• 支持片上应用可调谐的时域特征提取，增强了多传感器接口的场景适应性。

🏷 关键词

📄 原文摘要

Sanghyeon Cho, Yonggi Kim, Taejung Kim, Jong-Hyun Kwak, Geonjun Choi, Yoonsik Lee, Heungjoo Shin, Hoon Eui Jeong, Jae Joon Kim Ulsan National Institute of Science and Technology, Ulsan, Korea *Equally Credited Authors (ECAs) Heterogeneous multi-sensor patch devices should meet the requirements of various applications, and an adhesive interposer-based patch concept with integrated microscale structures is proposed to provide comfortable pressure-based reconfiguration capability where different kinds of sensor components are easily attached or detached for application-specific purposes. Furthermore, for embedding real-time edge-computing capability into a miniaturized patch device with a conventional legacy microcontroller, a multi-sensor patch interface IC is designed to include on-chip analog feature-extraction and classification engines, supporting various sensor interfaces in environmental and

👥 作者与机构

Jeonghoon Cho*, You Jang Pyeon*, Junyeong Yeom*, Hyunjoong Kim*,