← 返回论文列表 📄 下载原文 PDF  ISSCC 2025 · 13.6
ISSCC 2025Session 13 · COOL COMPUTATION CIRCUITSOther

A Via-Programmable DNN-Processor Fabrication Toward 1/40th Mask Cost

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

该论文提出了一种基于通孔可编程神经元阵列(VPNA)的单掩模可定制制造方案,用于低功耗DNN处理器,旨在解决传统ASIC掩模成本高昂的问题,将掩模成本降低至1/40。

💡 主要创新点

重要性
发表年份
ISSCC 2025

🏷 关键词

通孔可编程DNN处理器低功耗掩模成本可穿戴AI-IoT

📄 原文摘要

Growing interest in healthcare has led to the development of many wearable battery-powered artificial-intelligence internet-of-things (AI-IoT) devices for continuous monitoring a wide variety of vital signs [1, 2] (Fig. 13.6.1). While analog-based compute-in-memory (CiM) ASICs are effective in reducing power consumption, it is not realistic to prepare a wide variety of ASICs each of which incurs substantial mask costs. To address this issue, a single-mask customizable fabrication scheme for low-power DNN processors utilizing via-programmable neuron array (VPNA) is proposed. While diverse DNN layers are realized by arranging the placement of vias on a uniquely designed base chip, there are two major challenges: the large area overhead of the programmable routing wires and the large number of nodes and parameters required to implement DNN layers. The bit- and neuron-serial circuit (BNSC) technique reduces the implementation area by

👥 作者与机构

Jaewon Shin, Rei Sumikawa, Dongzhu Li, Mototsugu Hamada, Atsutake Kosuge

University of Tokyo, Tokyo, Japan

分类:Other · 年份:ISSCC 2025