⚡ 本页包含 AI 生成的分析内容，仅供参考
本文介绍了Broadcom的Tomahawk5（TH5）单片交换芯片，采用5nm工艺实现51.2Tb/s的交换容量，是前代产品的两倍，专为下一代数据中心和AI网络设计。芯片集成了Peregrine SerDes技术，解决了高带宽、低延迟和功耗效率的关键挑战。
(BCM78900 series, aka TH5) chip and the challenges of implementing a 51.2Tb/s advanced Ethernet switch in a monolithic die. We will describe several technologies that enabled TH5 realization and its advanced capabilities. TH5 is a cutting-edge switch chip designed for next-generation data center and AI networks. This chip represents a significant advancement in switch chip technology, offering 51.2Tb/s of switching capacity, which is double the bandwidth of its predecessors [1]. Integrated into the Tomahawk5 switch is Broadcom’s Peregrine SerDes technology, which represents a significant advancement in high-speed data transmission for networking applications. The integrated SerDes cores provide native support for numerous physical connectivity options, including direct attach copper (DAC), front panel
Asad Khamisy1, Mohan Kalkunte1, Peter Del Vecchio1, Yokai Cheok1, Greg Barsky1,
Karlheinz Muth1, Reza Sharifi2 Broadcom, San Jose, CA Broadcom, Irvine, CA 1 2 This paper provides an overview of Broadcom’s Tomahawk5