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ISSCC 2025Session 16 · HIGHLIGHTED CHIP RELEASES: DIGITAL AND MACHINE LEARNING PROCESSORSDigital Processors5nm

SambaNova SN40L: A 5nm 2.5D Dataflow Accelerator with Three Memory Tiers for Trillion Parameter AI

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文介绍了SambaNova SN40L,一款基于5nm工艺的2.5D数据流加速器,专为支持万亿参数AI模型设计。它通过三级存储系统(片上SRAM、封装HBM、片外DRAM)解决大模型的内存瓶颈,并采用CoWoS-S中介层集成两个加速器die与HBM。

💡 主要创新点

工艺节点
5nm
重要性
发表年份
ISSCC 2025

🏷 关键词

数据流加速器三级存储万亿参数AICoWoS-S封装可重构架构

📄 原文摘要

Mahmood Khayatzadeh, Kyunglok Kim, Uma Durairajan, Jeongha Park, Satyajit Sarkar, Jinuk Luke Shin SambaNova Systems, Palo Alto, CA The SN40L is the latest-generation Reconfigurable Dataflow Unit (RDU) from SambaNova Systems built for modern AI training and inference applications [1,2]. The SN40L combines on-chip dataflow flexibility with a three-tier memory system: on-chip SRAM, on-package High Bandwidth Memory (HBM), and off-package DRAM (Fig. 16.4.7). The SN40L employs 3× CoWoS-S interposer technology featuring two identical accelerator dies and HBM memory modules. To enable both high-bandwidth and high-capacity memory accesses from a single chip, along with peer-to-peer fabric and die-to-die connectivities, a dual-die approach is adopted, where the size of each die is 600mm2 (Fig. 16.4.1). Furthermore, a sub-reticle size dual-die design optimizes performance, thermal efficiency, and cost. The

👥 作者与机构

Raghu Prabhakar, Junwei Zhou, Darshan Gandhi, Youngmoon Choi,

分类:Digital Processors · 年份:ISSCC 2025