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ISSCC 2025Session 33 · COMPONENTS FOR BEYOND 100GHZOther

A 232-to-260GHz CMOS Amplifier-Multiplier Chain with a

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📋 论文概要

该论文提出了一种工作在232-260GHz的CMOS放大器-倍频器链,并采用低成本匹配片辅助辐射封装,实现了11.1dBm的总辐射功率,解决了CMOS太赫兹源辐射功率不足的问题。

💡 主要创新点

核心指标
11.1dBm总辐射功率
重要性
发表年份
ISSCC 2025

🏷 关键词

太赫兹CMOS放大器-倍频器链辐射封装匹配片

📄 原文摘要

Jinchen Wang, Daniel Sheen, Xibi Chen, Steven F. Nagle, Ruonan Han Massachusetts Institute of Technology, Cambridge, MA Terahertz (THz) signal sources and radiators are essential for a variety of future applications, such as high-resolution radar imaging [1], molecular spectroscopy, and clocks [2], as well as high-speed or miniature-platform communications [3]. For over a decade, the growing interest in CMOS-based compact THz radiation sources has been driven by their small form factor and integration with other analog/digital systems. However, the total radiated power of prior CMOS THz sources was still only several mW, not only due to the limited fmax and breakdown voltages of the CMOS transistors, but also due to the inefficient on-chip radiation approaches. Front-side radiation, typically based on a patch antenna implemented using the CMOS BEOL, allows for low-cost packaging and reliable heat dissipation. However, the

👥 作者与机构

Low-Cost, Matching-Sheet-Assisted Radiation Package and, 11.1dBm Total Radiated Power

分类:Other · 年份:ISSCC 2025