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ISSCC 2025Session 36 · ULTRA-HIGH-DENSITY D2D AND HIGH-PERFORMANCE OPTICAL TRANSCEIVERSRF & Wireless

A 64Gb/s/wire 10.5Tb/s/mm/layer Single-Ended Simultaneous Bi-Directional Transceiver with Echo and Crosstalk Cancellation for a Die-to-Die Interface in 28nm CMOS

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📋 论文概要

该论文提出了一种单端同时双向收发器,利用回波和串扰消除技术实现了64Gb/s/wire的数据率和10.5Tb/s/mm/layer的密度。解决了同时双向信令中回波和串扰导致性能下降的问题,适用于超高频D2D接口。

💡 主要创新点

核心指标
64Gb/s/wire, 10.5Tb/s/mm/layer
重要性
发表年份
ISSCC 2025

🏷 关键词

同时双向收发器回波消除串扰消除Die-to-Die接口高密度互连

📄 原文摘要

The development of artificial intelligence and high-performance computing has fueled the demand for increased edge density and reduced bit error rate (BER) in die-to-die interfaces. One approach to improving the edge density is increasing the per-wire data rate [1-5]. Four-level pulse amplitude modulation (PAM-4) is adopted to double the data rate; however, the degraded SNR makes it challenging to achieve an extremely low BER [2]. Simultaneous bi-directional (SBD) signaling is another effective method to double the data rate, but it is vulnerable to echo and crosstalk. An echo cancellation (EC) circuit is presented in [6], but it consumes significant power, making it unsuitable for die-to-die interfaces. Ground

👥 作者与机构

Zhifei Wang1, Zhiwen Huang1, Tianchen Ye1, Bingyi Ye2, Fangzhu Li1, Wei Wang1,3,

Dunshan Yu1, Weixin Gai1,3 Peking University, Beijing, China East China Normal University, Shanghai, China 3 Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China 1

分类:RF & Wireless · 年份:ISSCC 2025