SHINSAI: A 586mm2 Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory

📋 论文概要

本文提出了一种名为SHINSAI的可重用有源TSV中介层，集成了可编程互连架构和512Mb 3D底层存储器，旨在解决3D集成中互连密度和能效的瓶颈问题。通过垂直堆叠接口和可编程互连，实现了高带宽、低延迟的数据传输。

💡 主要创新点

• 提出了一种可重用的有源TSV中介层，支持可编程互连架构，提高了3D集成的灵活性和复用性。
• 集成了512Mb 3D底层存储器，实现了高密度存储与逻辑的垂直集成。
• 设计了V-Link接口电路，包含5通道32lane数据传输，采用全数字物理层电路实现高速串行化传输。

🏷 关键词

📄 原文摘要

Zexing Chen1, Mochen Tian2, Jundong Zhu2, Dexin Wen2, Yan Wang2, Yu Wang2, Jian Xu2, Feng Wang2, Jun Tao1, Chixiao Chen1, Qi Liu1, Ming Liu1 Fudan University, Shanghai, China Kiwimoore Semiconductors, Shanghai, China Figure 37.4.3 shows one cluster of the V-Link interface circuit, including 5 channels of 32lane data transmission. The top-die interface module initially converts parallel bus signals into flits per a specified protocol, then serializes these signals at a higher rate for transmission through the fully digital physical layer circuits on the vertical stacking interface

👥 作者与机构

Bo Jiao*1, Haozhe Zhu*1, Yuman Zeng1, Yongjiang Li1, Jie Liao1, Siyao Jia1,