⚡ 本页包含 AI 生成的分析内容，仅供参考
该论文提出了一种动态移动性能增强（DMPA）技术，通过升压占空比控制（BDC）和自适应热冷却器（ATC）来提升CPU最大性能。BDC利用老化传感器（A-sensor）在老化预算内进行性能提升，ATC集成温度传感器（T-sensor）并配合多个传感器和节流器优化时钟速度，有效解决了移动CPU在性能和热管理之间的权衡问题。
Huaichung Chang1, C.-J. Tsai1, Yi-Chang Zhuang1, Barry Chen1, Ericbill Wang1, Hugh Mair2, Shih-Arn Hwang1 MediaTek, Hsinchu, Taiwan, 2MediaTek, Austin, TX 1 Abstract This work presents dynamic mobile-performance augmentation (DMPA), featuring boostingduty control (BDC) and an adaptive thermal cooler (ATC) to augment CPU maximum performance. The BDC uses an aging sensor (A-sensor) to leverage an aging budget for performance boosting. For thermal, the ATC integrates temperature sensors (T-sensors) across the CPU and works with multiple sensors and a throttler to optimize clock speed effectively cooling hotspots. The DMPA offers a score of 3917 in the GeekBenchv6 singlecore benchmark on a flagship smartphone, consuming 0.078% or less total power, while occupying only 0.0122% of the CPU area. Significant performance improvements in flagship smartphones and tablets are fulfilling the demands of high-end gaming, achieving a rich display with a stable high frame rate per
Chien-Yu Lu1, Bo-Jr Huang1, Sung S.-Y. Hsueh1, Trong-Hieu Tran1, Eric Jia-Wei Fang1, Chao-Yang Yeh1, Quan Sun2, Tao Chen2, Hsinchen Chen2,